Tension - Serrage: ±40V, La technologie: Mixed Technology, Nombre de circuits: 3, Applications: General Purpose, Type de montage: Surface Mount, Paquet / Caisse: 8-SOIC (0.154", 3.90mm Width),
Tension - Serrage: ±40V, La technologie: Mixed Technology, Nombre de circuits: 8, Applications: General Purpose, Type de montage: Through Hole, Paquet / Caisse: 18-DIP (0.300", 7.62mm),
La technologie: Mixed Technology, Nombre de circuits: 1, Applications: General Purpose, Type de montage: Surface Mount, Paquet / Caisse: 8-WDFN Exposed Pad,
La technologie: Mixed Technology, Nombre de circuits: 1, Applications: VGA Port Protector, Type de montage: Surface Mount, Paquet / Caisse: 16-WFQFN Exposed Pad,
La technologie: Mixed Technology, Nombre de circuits: 1, Applications: VGA Port Protector, Type de montage: Surface Mount, Paquet / Caisse: 16-WFQFN Exposed Pad,
Tension - Serrage: ±40V, La technologie: Mixed Technology, Nombre de circuits: 3, Applications: General Purpose, Type de montage: Surface Mount, Paquet / Caisse: 8-SOIC (0.154", 3.90mm Width),
Tension - Serrage: ±40V, La technologie: Mixed Technology, Nombre de circuits: 8, Applications: General Purpose, Type de montage: Surface Mount, Paquet / Caisse: 18-SOIC (0.295", 7.50mm Width),
Tension - Serrage: ±40V, La technologie: Mixed Technology, Nombre de circuits: 8, Applications: General Purpose, Type de montage: Surface Mount, Paquet / Caisse: 18-SOIC (0.295", 7.50mm Width),
La technologie: Mixed Technology, Nombre de circuits: 1, Applications: VGA Port Protector, Type de montage: Surface Mount, Paquet / Caisse: 16-WFQFN Exposed Pad,
Tension - Serrage: ±40V, La technologie: Mixed Technology, Nombre de circuits: 3, Applications: General Purpose, Type de montage: Through Hole, Paquet / Caisse: 8-DIP (0.300", 7.62mm),
Tension - Serrage: ±40V, La technologie: Mixed Technology, Nombre de circuits: 3, Applications: General Purpose, Type de montage: Surface Mount, Paquet / Caisse: 8-SOIC (0.154", 3.90mm Width),
La technologie: Mixed Technology, Nombre de circuits: 1, Applications: General Purpose, Type de montage: Surface Mount, Paquet / Caisse: 8-WFDFN Exposed Pad,
La technologie: Mixed Technology, Nombre de circuits: 1, Applications: General Purpose, Type de montage: Surface Mount, Paquet / Caisse: 8-WDFN Exposed Pad,
Tension - Serrage: ±40V, La technologie: Mixed Technology, Nombre de circuits: 8, Applications: General Purpose, Type de montage: Surface Mount, Paquet / Caisse: 18-SOIC (0.295", 7.50mm Width),
Tension - Serrage: ±40V, La technologie: Mixed Technology, Nombre de circuits: 8, Applications: General Purpose, Type de montage: Surface Mount, Paquet / Caisse: 18-SOIC (0.295", 7.50mm Width),
La technologie: Mixed Technology, Nombre de circuits: 1, Applications: General Purpose, Type de montage: Surface Mount, Paquet / Caisse: 6-TSSOP, SC-88, SOT-363,
La technologie: Mixed Technology, Nombre de circuits: 1, Applications: General Purpose, Type de montage: Surface Mount, Paquet / Caisse: 8-WDFN Exposed Pad,
La technologie: Mixed Technology, Nombre de circuits: 1, Applications: General Purpose, Type de montage: Surface Mount, Paquet / Caisse: 8-WDFN Exposed Pad,
Tension - Serrage: ±40V, La technologie: Mixed Technology, Nombre de circuits: 8, Applications: General Purpose, Type de montage: Through Hole, Paquet / Caisse: 18-DIP (0.300", 7.62mm),
La technologie: Mixed Technology, Nombre de circuits: 1, Applications: VGA Port Protector, Type de montage: Surface Mount, Paquet / Caisse: 16-WFQFN Exposed Pad,
Tension - Serrage: ±40V, La technologie: Mixed Technology, Nombre de circuits: 3, Applications: General Purpose, Type de montage: Surface Mount, Paquet / Caisse: 8-SOIC (0.154", 3.90mm Width),
Tension - Serrage: ±40V, La technologie: Mixed Technology, Nombre de circuits: 3, Applications: General Purpose, Type de montage: Through Hole, Paquet / Caisse: 8-DIP (0.300", 7.62mm),