Taper: Solder Paste, Type de flux: No-Clean,
Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423°F (217°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: Sn63Pb37 (63/37), Point de fusion: 361°F (183°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423°F (217°C),
Taper: Solder Paste, Point de fusion: 546 ~ 567°F (286 ~ 297°C),
Taper: Wire Solder, Composition: Sn60Pb40 (60/40), Diamètre: 0.064" (1.63mm), Point de fusion: 361 ~ 374°F (183 ~ 190°C), Type de flux: No-Clean, Calibre du fil: 14 AWG, 16 SWG,
Taper: Wire Solder, Composition: Sn96.5Ag3.5 (96.5/3.5), Diamètre: 0.063" (1.60mm), Point de fusion: 430°F (221°C), Calibre du fil: 14 AWG, 16 SWG,
Taper: Solder Paste, Composition: Sn63Pb37 (63/37), Point de fusion: 361°F (183°C), Type de flux: Water Soluble,
Taper: Wire Solder, Composition: Sn63Pb37 (63/37), Diamètre: 0.032" (0.81mm), Point de fusion: 361°F (183°C), Type de flux: Rosin Mildly Activated (RMA), Calibre du fil: 20 AWG, 21 SWG,
Taper: Wire Solder, Composition: Sn63Pb37 (63/37), Diamètre: 0.022" (0.56mm), Point de fusion: 361°F (183°C), Type de flux: Rosin Mildly Activated (RMA), Calibre du fil: 23 AWG, 24 SWG,
Taper: Solder Paste, Composition: Bi58Sn42 (58/42), Point de fusion: 281°F (138°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Point de fusion: 411 ~ 424°F (209 ~ 218°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Point de fusion: 410 ~ 424°F (209 ~ 218°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Point de fusion: 409 ~ 424°F (209 ~ 218°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: SnAg3.8Cu0.7Bi3Sb1.4Ni0.15, Point de fusion: 408 ~ 424°F (209 ~ 218°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 350°F (177°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 401 ~ 424°F (205 ~ 218°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7), Point de fusion: 423°F (217°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: Sn62Pb36Ag2 (62/36/2), Point de fusion: 354°F (179°C), Type de flux: Water Soluble,
Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423°F (217°C), Type de flux: Water Soluble,
