Taper: Solder Paste, Composition: Sn63Pb37 (63/37), Point de fusion: 361°F (183°C), Type de flux: Water Soluble,
Taper: Solder Paste, Two Part Mix, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Point de fusion: 281°F (138°C), Type de flux: No-Clean,
Taper: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diamètre: 0.020" (0.51mm), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: No-Clean, Water Soluble, Calibre du fil: 24 AWG, 25 SWG,
Taper: Solder Sphere, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diamètre: 0.014" (0.36mm), Point de fusion: 423 ~ 428°F (217 ~ 220°C),
Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: Water Soluble,
Taper: Wire Solder, Composition: Sn99.3Cu0.7 (99.3/0.7), Diamètre: 0.020" (0.51mm), Point de fusion: 441°F (227°C), Type de flux: No-Clean, Water Soluble,
Taper: Solder Paste, Composition: Sn96.5Ag3.5 (96.5/3.5), Point de fusion: 430°F (221°C), Type de flux: Water Soluble,
Taper: Solder Sphere, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diamètre: 0.012" (0.31mm), Point de fusion: 423 ~ 428°F (217 ~ 220°C),
Taper: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diamètre: 0.031" (0.79mm), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: No-Clean, Water Soluble, Calibre du fil: 20 AWG, 22 SWG,
Taper: Solder Paste, Composition: Sn63Pb37 (63/37), Point de fusion: 361°F (183°C), Type de flux: No-Clean,
Taper: Wire Solder, Composition: Sn63Pb37 (63/37), Diamètre: 0.040" (1.02mm), Point de fusion: 361°F (183°C), Type de flux: Rosin Activated (RA), Calibre du fil: 18 AWG, 19 SWG,
