Souder | Produits à souder, à dessouder, &agr | 32

SMD2SWLF.020 1LB

stock de pièces: 176

Taper: Wire Solder, Composition: Sn99.3Cu0.7 (99.3/0.7), Diamètre: 0.020" (0.51mm), Point de fusion: 441°F (227°C), Type de flux: No-Clean, Water Soluble, Calibre du fil: 24 AWG, 25 SWG,

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Chip Quik Inc.

SMD291SNLT4

stock de pièces: 9

Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: No-Clean,

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Chip Quik Inc.

SMD291SNL

stock de pièces: 4598

Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: No-Clean,

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Chip Quik Inc.

SMDSWLF.015 1LB

stock de pièces: 186

Taper: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diamètre: 0.015" (0.38mm), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: No-Clean, Water Soluble, Calibre du fil: 27 AWG, 28 SWG,

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Chip Quik Inc.

SMD2SWLF.031 8OZ

stock de pièces: 240

Taper: Wire Solder, Composition: Sn99.3Cu0.7 (99.3/0.7), Diamètre: 0.031" (0.79mm), Point de fusion: 441°F (227°C), Type de flux: No-Clean, Water Soluble, Calibre du fil: 20 AWG, 22 SWG,

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Chip Quik Inc.

SMD291SNL10T4

stock de pièces: 2534

Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: No-Clean,

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Chip Quik Inc.

TS391SNL500C

stock de pièces: 91

Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: No-Clean,

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Chip Quik Inc.

SMD2195

stock de pièces: 130

Taper: Solder Sphere, Composition: Sn63Pb37 (63/37), Diamètre: 0.022" (0.56mm), Point de fusion: 361°F (183°C),

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Chip Quik Inc.

SMD2040

stock de pièces: 632

Taper: Solder Sphere, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diamètre: 0.020" (0.51mm), Point de fusion: 423 ~ 428°F (217 ~ 220°C),

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Chip Quik Inc.

SMD291SNLT5

stock de pièces: 58

Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: No-Clean,

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Chip Quik Inc.

SMD2140-25000

stock de pièces: 158

Taper: Solder Sphere, Composition: Sn63Pb37 (63/37), Diamètre: 0.008" (0.20mm), Point de fusion: 361°F (183°C),

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Chip Quik Inc.

SMDLTLFP10T5

stock de pièces: 2288

Taper: Solder Paste, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Point de fusion: 281°F (138°C), Type de flux: No-Clean,

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Chip Quik Inc.

SMD2SWLF.031 .7OZ

stock de pièces: 677

Taper: Wire Solder, Composition: Sn99.3Cu0.7 (99.3/0.7), Diamètre: 0.031" (0.79mm), Point de fusion: 441°F (227°C), Type de flux: No-Clean, Water Soluble, Calibre du fil: 20 AWG, 21 SWG,

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Chip Quik Inc.

SMDLTLFP500T3

stock de pièces: 668

Taper: Solder Paste, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Point de fusion: 281°F (138°C), Type de flux: No-Clean,

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Chip Quik Inc.

SMD2140

stock de pièces: 125

Taper: Solder Sphere, Composition: Sn63Pb37 (63/37), Diamètre: 0.008" (0.20mm), Point de fusion: 361°F (183°C),

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Chip Quik Inc.

TS391SNL50

stock de pièces: 996

Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: No-Clean,

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Chip Quik Inc.

SMD2200-25000

stock de pièces: 2778

Taper: Solder Sphere, Composition: Sn63Pb37 (63/37), Diamètre: 0.024" (0.61mm), Point de fusion: 361°F (183°C),

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Chip Quik Inc.

SMD2SWLF.015 4OZ

stock de pièces: 349

Taper: Wire Solder, Composition: Sn99.3Cu0.7 (99.3/0.7), Diamètre: 0.015" (0.38mm), Point de fusion: 441°F (227°C), Type de flux: No-Clean, Water Soluble,

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Chip Quik Inc.

SMDSWLF.015 8OZ

stock de pièces: 297

Taper: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diamètre: 0.015" (0.38mm), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: No-Clean, Water Soluble, Calibre du fil: 27 AWG, 28 SWG,

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Chip Quik Inc.

SMD2SWLF.031 4OZ

stock de pièces: 323

Taper: Wire Solder, Composition: Sn99.3Cu0.7 (99.3/0.7), Diamètre: 0.031" (0.79mm), Point de fusion: 441°F (227°C), Type de flux: No-Clean, Water Soluble,

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Chip Quik Inc.

SMD2215

stock de pièces: 938

Taper: Solder Sphere, Composition: Sn63Pb37 (63/37), Diamètre: 0.030" (0.76mm), Point de fusion: 361°F (183°C),

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Chip Quik Inc.

SMDIN97AG3

stock de pièces: 250

Taper: Wire Solder, Composition: In97Ag3 (97/3), Diamètre: 0.031" (0.79mm), Point de fusion: 289°F (143°C), Calibre du fil: 20 AWG, 21 SWG,

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Chip Quik Inc.

SMDSWLTLFP32

stock de pièces: 1985

Taper: Wire Solder, Composition: Bi57Sn42Ag1 (57/42/1), Diamètre: 0.030" (0.76mm), Point de fusion: 281°F (138°C), Calibre du fil: 21 AWG, 22 SWG,

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Chip Quik Inc.

SMD2190-25000

stock de pièces: 2704

Taper: Solder Sphere, Composition: Sn63Pb37 (63/37), Diamètre: 0.020" (0.51mm), Point de fusion: 361°F (183°C),

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Chip Quik Inc.

SMDSW.031 .7OZ

stock de pièces: 594

Taper: Wire Solder, Composition: Sn63Pb37 (63/37), Diamètre: 0.031" (0.79mm), Point de fusion: 361°F (183°C), Type de flux: No-Clean, Water Soluble, Calibre du fil: 20 AWG, 21 SWG,

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Chip Quik Inc.

SMDLTLFP500T3C

stock de pièces: 618

Taper: Solder Paste, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Point de fusion: 281°F (138°C), Type de flux: No-Clean,

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Chip Quik Inc.

SMDLTLFP500T5C

stock de pièces: 422

Taper: Solder Paste, Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4), Point de fusion: 281°F (138°C), Type de flux: No-Clean,

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Chip Quik Inc.

TS391AX250

stock de pièces: 185

Taper: Solder Paste, Composition: Sn63Pb37 (63/37), Point de fusion: 361°F (183°C), Type de flux: No-Clean,

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Chip Quik Inc.

SMD291SNL250T4

stock de pièces: 1172

Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: No-Clean,

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Chip Quik Inc.

SMD4300AX250T4

stock de pièces: 1419

Taper: Solder Paste, Composition: Sn63Pb37 (63/37), Point de fusion: 361°F (183°C), Type de flux: Water Soluble,

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Chip Quik Inc.

SMD291SNL500T3

stock de pièces: 761

Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423 ~ 428°F (217 ~ 220°C), Type de flux: No-Clean,

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Chip Quik Inc.

SMD3SW.020 1OZ

stock de pièces: 311

Taper: Wire Solder, Composition: Sn62Pb36Ag2 (62/36/2), Diamètre: 0.020" (0.51mm), Point de fusion: 354°F (179°C), Type de flux: No-Clean, Water Soluble,

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Chip Quik Inc.

SMD2032-25000

stock de pièces: 101

Taper: Solder Sphere, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diamètre: 0.016" (0.40mm), Point de fusion: 423 ~ 428°F (217 ~ 220°C),

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Micro-Measurements (Division of Vishay Precision G

MMF301501

stock de pièces: 143

Taper: Wire Solder, Composition: Sn95Sb5 (95/5), Diamètre: 0.020" (0.51mm), Point de fusion: 450 ~ 460°F (232 ~ 238°C), Type de flux: Rosin Activated (RA), Calibre du fil: 24 AWG, 25 SWG,

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Multicore

MM01075

stock de pièces: 9080

Taper: Wire Solder, Composition: Sn63Pb37 (63/37), Diamètre: 0.024" (0.61mm), Point de fusion: 361°F (183°C), Type de flux: Water Soluble, Calibre du fil: 22 AWG, 23 SWG,

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Chemtronics

S200

stock de pièces: 1811

Taper: Wire Solder, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Diamètre: 0.040" (1.02mm), Point de fusion: 423 ~ 424°F (217 ~ 218°C), Type de flux: Rosin Activated (RA), Calibre du fil: 18 AWG, 19 SWG,

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