Taper: Solder Paste, Composition: Sn63Pb37 (63/37), Point de fusion: 361°F (183°C), Type de flux: Rosin Mildly Activated (RMA),
Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423 ~ 424°F (217 ~ 218°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5), Point de fusion: 423 ~ 424°F (217 ~ 218°C), Type de flux: Water Soluble,
Taper: Solder Paste, Composition: Sn62Pb36Ag2 (62/36/2), Point de fusion: 354°F (179°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: Sn63Pb37 (63/37), Point de fusion: 361°F (183°C), Type de flux: Water Soluble,
Taper: Solder Paste, Composition: Sn63Pb37 (63/37), Point de fusion: 361°F (183°C), Type de flux: No-Clean,
Taper: Solder Paste, Composition: Sn62Pb36Ag2 (62/36/2), Point de fusion: 354°F (179°C), Type de flux: Water Soluble,
Taper: Solder Paste, Composition: Sn99.3Cu0.7 (99.3/0.7), Point de fusion: 441°F (227°C), Type de flux: No-Clean,
