Taper: Encoder, Applications: RF, IR, Type de montage: Through Hole, Paquet / Caisse: 14-DIP (0.300", 7.62mm), Package d'appareils du fournisseur: 14-DIP,
Taper: Digital Controller, Applications: Image Processing and Control, Type de montage: Surface Mount, Paquet / Caisse: 780-BGA, Package d'appareils du fournisseur: 780-BGA (29x29),
Taper: Digital Controller, Applications: Image Processing and Control, Type de montage: Surface Mount, Paquet / Caisse: 676-BBGA, FCBGA, Package d'appareils du fournisseur: 676-FCBGA (27x27),
Taper: Digital Micromirror Device (DMD), Applications: 3D, Medical Imaging, Type de montage: Surface Mount, Paquet / Caisse: 355-CLCC, Package d'appareils du fournisseur: 355-LCCC (42.16x42.16),
Taper: Overvoltage and Overcurrent Controller, Applications: Cell Phones, Digital Cameras, Media Players, Type de montage: Surface Mount, Paquet / Caisse: 14-WFDFN Exposed Pad, Package d'appareils du fournisseur: 14-TDFN-EP (3x3),
Taper: Floating-Point Co-Processor, Type de montage: Through Hole, Paquet / Caisse: 68-CPGA, Package d'appareils du fournisseur: 68-CPGA (26.92x26.92),